pcb专业英语**ProcessModule說明: A.下料(CutLamination) a-1裁板(SheetsCutting) a-2原物料發料(Panel)(ShearmaterialtoSize) B.鑽孔(Drilling) b-1內鑽(InnerLayerDrilling) b-2一次孔(OuterLayerDrilling) b-3二次孔(2ndDrilling) b-4雷射鑽孔(LaserDrilling)(LaserAblation) b-5盲(埋)孔鑽孔(BlindBuriedHoleDrilling) C.乾膜製程(PhotoProcess(D/F)) c-1前處理(Pretreatment) c-2壓膜(DryFilmLamination) c-3曝光(Exposure) c-4顯影(Developing) c-5蝕銅(Etching) c-6去膜(Stripping) c-7初檢(Touch-up) c-8化學前處理,化學研磨(ChemicalMilling) c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination) c-10顯影(Developing) c-11去膜(Stripping) D.壓合Lamination d-1黑化(BlackOxideTreatment) d-2微蝕(Microetching) Developing,EtchingStripping(DES)pcb专业英语*d-3鉚釘組合(eyelet) d-4疊板(Layup) d-5壓合(Lamination) d-6後處理(PostTreatment) d-7黑氧化(BlackOxideRemoval)d-8銑靶(spotface)d-9去溢膠(resinflushremoval)E.減銅(CopperReduction) e-1薄化銅(CopperReduction) F.電鍍(HorizontalElectrolyticPlating) f-1水平電鍍(HorizontalElectro-Plating)(PanelPlating) f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating) f-3低於1mil(Lessthan1milThickness) f-4高於1mil(Morethan1milThickness) f-5砂帶研磨(BeltSanding) f-6剝錫鉛(Tin-LeadStripping) f-7微切片(Microsection) G.塞孔(PlugHole) g-1印刷(InkPrint) g-2預烤(Precure) g-3表面刷磨(Scrub) g-4後烘烤(Postcure) H.防焊(綠漆):(SolderMask) h-1C面印刷(PrintingTopSide) h-2S面印刷(PrintingBottomSide) h-3靜電噴塗(SprayCoating) h-4前處理(Pretreatment) h-5預烤(Precure) h-6曝光(Exposure) h-7顯影(