2025年2月电镀与精饰第47卷第2期(总第383期)·89·
doi:10.3969/j.issn.1001-3849.2025.02.013
铝合金无氰镀银热震鼓泡原因分析
?
牛鎏，董源，陈玉平，张家强
(中国空间技术研究院，北京100094)
摘要：电镀无氰化是电镀行业未来发展的重要目标。目前无氰电镀在镀层结合力、致密度、纯度等方面一般低于
氰化物电镀工艺。铝合金无氰镀银试片在热震后经常出现鼓泡现象，许多电镀从业人员分析认为是浸锌工艺造成
的。经过多次改进工艺参数的实验并结合鼓泡样品的SEM观察和分析，铝合金无氰镀银鼓泡现象的原因应是热
震时水与铝合金基体表面发生反应，生成氢气顶起镀层造成的。
关键词：无氰电镀；铝合金；银镀层；鼓泡；热震
中图分类号：TQ153.1文献标识码：A
Analysisofbubblingphenomenonafterthermalshockofcyanide-free
silverplatingofaluminumalloy
*
NiuLiu,DongYuan,ChenYuping,ZhangJiaqiang
(ChinaAcademyofSpaceTechnology,Beijing100094,China)
Abstract:Cyanide-freeelectroplatingisanimportantgoalofelectroplatingindustryinthefuture.At
present,cyanide-freeelectroplatingislowerthancyanideelectroplatingprocessintermsofcoating
adhesion,densityandpurity.Non-cyanidesilverplatingtestsheetofaluminumalloyoftenappears
bubblingafterthermalshock.Manyelectroplatingpractitionersbelievethatitiscausedbyzincdipping
process.Inthisexperiment,afterseveralprocessimprovementmethods,SEMobservationandanalysis
wereusedtospeculatethatthereasonforthebubblephenomenonofcyanide-freesilverplatingof
aluminumalloywascausedbythereactionbetweenwaterandthesurfaceofaluminumalloymatrix
duringthermalshock,resultinginhydrogenjackingupthecoating.
Keywords:cyanide-freeelectroplating;aluminumalloy;silverplating;bubbling;therm